The report offers detailed coverage of 3D TSV industry and main market trends. The market research includes historical and forecast market data, demand, application details, price trends, and company shares of the leading 3D TSV by geography. The report splits the market size, by volume and value, on the basis of application type and geography.
3D TSV is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits. Compared to alternatives such as package-on-package, the interconnect and device density is substantially higher, and the length of the connections becomes shorter.
The report forecast global 3D TSV market to grow to reach xxx Million USD in 2020 with a CAGR of xx% during the period 2020-2025.
First, this report covers the present status and the future prospects of the global 3D TSV market for 2015-2025.
And in this report, we analyze global market from 5 geographies: Asia-Pacific[China, Southeast Asia, India, Japan, Korea, Western Asia], Europe[Germany, UK, France, Italy, Russia, Spain, Netherlands, Turkey, Switzerland], North America[United States, Canada, Mexico], Middle East & Africa[GCC, North Africa, South Africa], South America[Brazil, Argentina, Columbia, Chile, Peru].
At the same time, we classify 3D TSV according to the type, application by geography. More importantly, the report includes major countries market based on the type and application.
Market Segment as follows:
By Region
Asia-Pacific[China, Southeast Asia, India, Japan, Korea, Western Asia]
Europe[Germany, UK, France, Italy, Russia, Spain, Netherlands, Turkey, Switzerland]
North America[United States, Canada, Mexico]
Middle East & Africa[GCC, North Africa, South Africa]
South America[Brazil, Argentina, Columbia, Chile, Peru]
Key Companies
Intel
Samsung
Toshiba
Amkor Technology
Pure Storage
Broadcom
Advanced Semiconductor Engineering
Taiwan Semiconductor Manufacturing Company
United Microelectronics
STMicroelectronics
Jiangsu Changing Electronics Technology
Market by Order Type
Memory
MEMS
CMOS Image Sensors
Imaging and Optoelectronics
Advanced LED Packaging
Others
Market by Application
Electronics
Information and Communication Technology
Automotive
Military, Aerospace and Defence
Others