3D TSV is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits. Compared to alternatives such as package-on-package, the interconnect and device density is substantially higher, and the length of the connections becomes shorter.
The 3D TSV market was valued at xx Million US$ in 2020 and is projected to reach xx Million US$ by 2026, at a CAGR of xx% during the forecast period. In this study, 2020 has been considered as the base year and 2021 to 2026 as the forecast period to estimate the market size for 3D TSV.
This report covers the present status and the future prospects of the global 3D TSV market for 2015-2026.
The report offers detailed coverage of 3D TSV industry and main market trends. The market research includes historical and forecast market data, demand, application details, price trends, and company shares of the leading 3D TSV by geography. The report splits the market size, by volume and value, on the basis of application type and geography.
And in this report, we analyze global market from 5 geographies: Asia-Pacific[China, Southeast Asia, India, Japan, Korea, Western Asia], Europe[Germany, UK, France, Italy, Russia, Spain, Netherlands, Turkey, Switzerland], North America[United States, Canada, Mexico], Middle East & Africa[GCC, North Africa, South Africa], South America[Brazil, Argentina, Columbia, Chile, Peru].
Key Companies
Intel, Samsung, Toshiba, Amkor Technology, Pure Storage, Broadcom, Advanced Semiconductor Engineering, Taiwan Semiconductor Manufacturing Company, United Microelectronics, STMicroelectronics, Jiangsu Changing Electronics Technology
Market Segment as follows:
Market by Order Type
Memory
MEMS
CMOS Image Sensors
Imaging and Optoelectronics
Advanced LED Packaging
Others
3D TSV Breakdown Data by Application
Electronics
Information and Communication Technology
Automotive
Military, Aerospace and Defence
Others
3D TSV market while maintaining their competitive edge over their competitors. The report offers detailed and crucial information to understand the overall market scenario.
By Region
Asia-Pacific[China, Southeast Asia, India, Japan, Korea, Western Asia]
Europe[Germany, UK, France, Italy, Russia, Spain, Netherlands, Turkey, Switzerland]
North America[United States, Canada, Mexico]
Middle East & Africa[GCC, North Africa, South Africa]
South America[Brazil, Argentina, Columbia, Chile, Peru]
The research provides answers to the following key questions:
• What is the estimated growth rate and market share and size of the 3D TSV market for the forecast period 2021 - 2026?
• What are the driving forces in the 3D TSV market for the forecast period 2021 - 2026?
• Who are the prominent market players and how have they gained a competitive edge over other competitors?
• What are the market trends influencing the progress of the 3D TSV industry worldwide?
• What are the major challenges and threats restricting the progress of the industry?
• What opportunities does the market hold for the prominent market players?
Note – In order to provide more accurate market forecast, all our reports will be updated before delivery by considering the impact of COVID-19.