The report offers detailed coverage of Semiconductor Packaging Equipment industry and main market trends. The market research includes historical and forecast market data, demand, application details, price trends, and company shares of the leading Semiconductor Packaging Equipment by geography. The report splits the market size, by volume and value, on the basis of application type and geography.
Semiconductor packaging is carried out to provide extra protection to wafers or substrates. The package casing is made up of materials such as metal, plastic, glass, or ceramic and contains one or more semiconductor electronic components.
Accounting for more than 55% of the total market shares, the die-level packaging equipment segment dominated the market. This growth can be attributed to the increasing demand for application processors, basebands, and SoCs, which are integrated into mobile and consumer electronic devices. Though the market shares of this segment will decline due to the use of advanced technologies, this segment will continue to dominate the market throughout the forecast period.
According to this market study, the OSATs will account for more than 58% of the total market shares and will also dominate the semiconductor packaging equipment market throughout the predicted period. The migration of a number of semiconductor manufacturers to the fabless model is identified to be the major factor for the growth of the market segment. Additionally, the development of new technologies such as FOWLP, 2.5D, and TSV has also increased the outsourcing of back-end processes, which will also fuel the growth of this market segment.
The report forecast global Semiconductor Packaging Equipment market to grow to reach xxx Million USD in 2020 with a CAGR of xx% during the period 2020-2025.
First, this report covers the present status and the future prospects of the global Semiconductor Packaging Equipment market for 2015-2025.
And in this report, we analyze global market from 5 geographies: Asia-Pacific[China, Southeast Asia, India, Japan, Korea, Western Asia], Europe[Germany, UK, France, Italy, Russia, Spain, Netherlands, Turkey, Switzerland], North America[United States, Canada, Mexico], Middle East & Africa[GCC, North Africa, South Africa], South America[Brazil, Argentina, Columbia, Chile, Peru].
At the same time, we classify Semiconductor Packaging Equipment according to the type, application by geography. More importantly, the report includes major countries market based on the type and application.
Market Segment as follows:
By Region
Asia-Pacific[China, Southeast Asia, India, Japan, Korea, Western Asia]
Europe[Germany, UK, France, Italy, Russia, Spain, Netherlands, Turkey, Switzerland]
North America[United States, Canada, Mexico]
Middle East & Africa[GCC, North Africa, South Africa]
South America[Brazil, Argentina, Columbia, Chile, Peru]
Key Companies
Applied Materials
ASM Pacific Technology
Kulicke and Soffa Industries
Tokyo Electron Limited
Tokyo Seimitsu
ChipMos
Greatek
Hua Hong
Jiangsu Changjiang Electronics Technology
Lingsen Precision
Nepes
Tianshui Huatian
Unisem
Ultratech
Market by Order Type
Die-Level Packaging Equipment
Wafer-Level Packaging Equipment
Market by Application
IDM (Integrated Device Manufacturers)
OSAT (Outsourced Semiconductor Assembly and Test Companies)