The report offers detailed coverage of Semiconductor Packaging and Test Equipment industry and main market trends.
The market research includes historical and forecast market data, demand, application details, price trends, and company shares of the leading Semiconductor Packaging and Test Equipment by geography. The report splits the market size, by volume and value, on the basis of application type and geography.
The report forecast global Semiconductor Packaging and Test Equipment market to grow to reach xxx Million USD in 2020 with a CAGR of xx% during the period 2021-2028.
Note – In order to provide more accurate market forecast, all our reports will be updated before delivery by considering the impact of COVID-19.
First, this report covers the present status and the future prospects of the global Semiconductor Packaging and Test Equipment market for 2015-2028.
In this report, we analyze global market from 5 geographies: Asia-Pacific[China, Southeast Asia, India, Japan, Korea, Western Asia], Europe[Germany, UK, France, Italy, Russia, Spain, Netherlands, Turkey, Switzerland], North America[United States, Canada, Mexico], Middle East & Africa[GCC, North Africa, South Africa], South America[Brazil, Argentina, Columbia, Chile, Peru].
Key Companies
TEL
DISCO
ASM
Tokyo Seimitsu
Besi
Semes
Cohu, Inc.
Techwing
Kulicke & Soffa Industries
Fasford
Advantest
Hanmi semiconductor
Shinkawa
Shen Zhen Sidea
DIAS Automation
Semiconductor Packaging and Test Equipment
At the same time, we classify Semiconductor Packaging and Test Equipment according to the type, application by geography. More importantly, the report includes major countries market based on the type and application.
Market by Order Type
Wafer Probe Station
Die Bonder
Dicing Machine
Test handler
Sorter
Wafer probe station has 37.3 percent market share of semiconductor packaging and test equipment in 2018, and it will stay the mian type in the whole market.
Die bonder takes about 29% market share of semiconductor packaging and test equipment in 2018, and it will continue to grow rapidly in the coming years.
The market share of dicing machine is 15.96% in 2018.
Test handler occupies 10.86 percent market share in 2018, and with the higher CAGR it will go on increasing from 2019 to 2025.
Sorter takes only 7.45% market share ofsemiconductor packaging and test equipment in 2018, and it will grow slowly in the coming years.
Semiconductor Packaging and Test EquipmentMarket by Application
Integrated Device Manufacturer (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)
IDMs occupy only 36% market share of semiconductor packaging and test equipment in 2018.
The market share of OSAT is 64 percent in 2018, and it will go on expanding in the next five years.
Semiconductor Packaging and Test Equipment
Market Segment as follows:
By Region
Asia-Pacific[China, Southeast Asia, India, Japan, Korea, Western Asia]
Europe[Germany, UK, France, Italy, Russia, Spain, Netherlands, Turkey, Switzerland]
North America[United States, Canada, Mexico]
Middle East & Africa[GCC, North Africa, South Africa]
South America[Brazil, Argentina, Columbia, Chile, Peru]
The research provides answers to the following key questions:
• What is the estimated growth rate and market share and size of the Semiconductor Packaging and Test Equipment market for the forecast period 2021 - 2028?
• What are the driving forces in the Semiconductor Packaging and Test Equipment market for the forecast period 2021 - 2028?
• Who are the prominent market players and how have they gained a competitive edge over other competitors?
• What are the market trends influencing the progress of the Semiconductor Packaging and Test Equipment industry worldwide?
• What are the major challenges and threats restricting the progress of the industry?
• What opportunities does the market hold for the prominent market players?
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