IC Substrate Market (Updated Version Available)

The universal IC Substrate market was valued at xxx million USD with a CAGR xx% from 2015-2019. Subsequently, it will touch xxx million USD in 2020 with a CAGR xx % from 2020 to 2025.
IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging, and the share of IC substrate for IC packaging is as high as 35-55%
Japan, Korea and Taiwan are dominating the global IC-Substrate market and have strong voices in high end market. China is also an important producer, but most of the products are low end products. Currently there are four Taiwanese producers have manufacturing bases in China mainland, mainly located in Suzhou, Kunshan and Shanghai; and there also four local producers located in Shenzhen, Chongqin, Zhuhai and Wuxi.
Currently, Ibiden, Shinko, Kyocera, Eastern, TTM Technologies, Unimicron, Kinsus, Nanya, ASE, Semco, LG Innotek, Simmtech, Daeduck, KCC (Korea Circuit Company), Zhen Ding Technology, AT&S, Shennan Circuit, ACCESS and Shenzhen Fastprint Circuit Tech are the well-known players in the global IC-Substrate market, and the top 10 players took up about 80% of the global market in 2018. Ibiden, Shinko, Kyocera are the Japanese well-known producers of IC-Substrate at present.

In the global IC Substrate market, This report focuses particularly in North America, South America, Europe and Asia-Pacific, and Middle East and Africa. This report classifies the market on the basis of application, type, regions, and manufactures.

In market segmentation by manufacturers, the report covers the following companies-
Ibiden
Shinko Electric Industries
Kyocera
Eastern
TTM Technologies
Unimicron
Kinsus
Nan Ya PCB
ASE Material
Semco
LG Innotek
Simmtech
Daeduck
Korea Circuit
Zhen Ding Technology
AT&S
Shennan Circuit
ACCESS
Shenzhen Fastprint Circuit Tech

In market segmentation by geographical regions, the report has analysed the following regions-
North America (USA, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Columbia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

In market segmentation by types :
WB BGA Substrate
WB CSP Substrate
FC BGA Substrate
FC CSP Substrate
Other Types

In market segmentation by applications :
PC (Tablet, Laptop)
Smart Phone
Wearable Devices (smart watch)
Other Applications

The research provides answers to the following key questions:
• What is the estimated growth rate and market share and size of the IC Substrate market for the forecast period 2020 - 2025?
• What are the driving forces in the IC Substrate market for the forecast period 2020 - 2025?
• Who are the prominent market players and how have they gained a competitive edge over other competitors?
• What are the market trends influencing the progress of the IC Substrate industry worldwide?
• What are the major challenges and threats restricting the progress of the industry?
• What opportunities does the market hold for the prominent market players?