Electronic devices are available in a variety of package types and include semiconductors (integrated circuits), magnets, capacitors, and resistors.
The semiconductor packaging services market has drawn the greatest attention in the investment community.
The Semiconductor packaging industry is expected to achieve a CAGR of 10% over the next three to five years. This trend is not only driven by the increasing market demand for packaging of components for various new semiconductor applications in the fields of radio, Internet and consumer products, but also external packaging assembly by semiconductor device manufacturers (SDM). Driven by the growth of test runs.
In 2019, the market size of Advanced Semiconductor Packaging is 22200 million US$ and it will reach 49500 million US$ in 2025, growing at a CAGR of 10.6% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Advanced Semiconductor Packaging.
This report studies the global market size of Advanced Semiconductor Packaging, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
This study presents the Advanced Semiconductor Packaging production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.
In global market, the following companies are covered:
AMD
Intel Corp
Amkor Technology
STMicroelectronics
Hitachi Chemical
Infineon
Avery Dennison
Sumitomo Chemical
ASE Group
Kyocera
Market Segment by Product Type
Fan-Out Wafer-Level Packaging (FO WLP)
Fan-In Wafer-Level Packaging (FI WLP)
Flip Chip (FC)
2.5D/3D
Market Segment by Application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
Other End Users
Key Regions split in this report: breakdown data for each region.
United States
China
European Union
Rest of World (Japan, Korea, India and Southeast Asia)
The study objectives are:
To analyze and research the Advanced Semiconductor Packaging status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
To present the key Advanced Semiconductor Packaging manufacturers, presenting the sales, revenue, market share, and recent development for key players.
To split the breakdown data by regions, type, companies and applications
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market
In this study, the years considered to estimate the market size of Advanced Semiconductor Packaging are as follows:
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025