Wire bonder equipment is the machinery used for making interconnects between an IC or any other semiconductor device at the time of packaging. This interconnection ensures the flow of electricity in the semiconductor device. The thin-wire used to make these connections are usually made of copper, gold, aluminum, or silver. Wire bonder equipment is part of the semiconductor assembly and packaging process.
According to the report, one of the major drivers for this market is incentives and discounts for long-term customers. The semiconductor capital equipment industry is characterized by relationship-based sales. The selling price of such equipment is usually in the range of $100,000-$1,000,000. Therefore, manufacturers look to develop long-standing relations with customers buying their product offerings. The outlook of building such relations is to ensure repeat purchases by offering discounts and incentives for future orders. This is mostly practiced on those customers who account for around 5-10% of the equipment manufacturers sales.
The report comprises of key players profiles namely consignment, price, revenue, profit interview records and sources of distribution. It helps clients get a better analysis of their competitors. In addition, it encompasses the regions and countries across the world and depicts the regional outlook, market size, volume, value and price data.
The Wire Bonder Equipment market was valued at xxx million USD with a CAGR xx% from 2015-2019. Subsequently, it will touch xxx million USD in 2020 with a CAGR xx % from 2020 to 2025.
In global market, the following companies are covered:
ASM Pacific Technology
Kulicke& Soffa
Palomar Technologies
Besi
DIAS Automation
F&K Delvotec Bondtechnik
Hesse
Hybond
SHINKAWA Electric
Toray Engineering
West Bond
Market Segment by Product Type
Ball Bonders
Stud-Bump Bonders
Wedge Bonders
Market Segment by Application
Steel
Manufacture
Others
Key Regions split in this report: breakdown data for each region.
United States
China
European Union
Rest of World (Japan, Korea, India and Southeast Asia)
The research provides answers to the following key questions:
• What is the estimated growth rate and market share and size of the Wire Bonder Equipment market for the forecast period 2020 - 2025?
• What are the driving forces in the Wire Bonder Equipment market for the forecast period 2020 - 2025?
• Who are the prominent market players and how have they gained a competitive edge over other competitors?
• What are the market trends influencing the progress of the Wire Bonder Equipment industry worldwide?
• What are the major challenges and threats restricting the progress of the industry?
• What opportunities does the market hold for the prominent market players?