3D IC & 2.5D IC Packaging Market (Updated Version Available)

The report offers detailed coverage of 3D IC & 2.5D IC Packaging industry and main market trends.

2.5D interposer is also a 3D WLP that interconnects die side-side on a silicon, glass or organic interposer using TSVs and RDL. In all types of 3D Packaging, chips in the package communicate using off-chip signaling, much as if they were mounted in separate packages on a normal circuit board.
3D ICs can be divided into 3D Stacked ICs (3D SIC), which refers to stacking IC chips using TSV interconnects, and monolithic 3D ICs, which use fab processes to realize 3D interconnects at the local levels of the on-chip wiring hierarchy as set forth by the ITRS, this results in direct vertical interconnects between device layers.

The market research includes historical and forecast market data, demand, application details, price trends, and company shares of the leading 3D IC & 2.5D IC Packaging by geography. The report splits the market size, by volume and value, on the basis of application type and geography.

The report forecast global 3D IC & 2.5D IC Packaging market to grow to reach xxx Million USD in 2020 with a CAGR of xx% during the period 2021-2026.

Note – In order to provide more accurate market forecast, all our reports will be updated before delivery by considering the impact of COVID-19.

First, this report covers the present status and the future prospects of the global 3D IC & 2.5D IC Packaging market for 2015-2026.
In this report, we analyze global market from 5 geographies: Asia-Pacific[China, Southeast Asia, India, Japan, Korea, Western Asia], Europe[Germany, UK, France, Italy, Russia, Spain, Netherlands, Turkey, Switzerland], North America[United States, Canada, Mexico], Middle East & Africa[GCC, North Africa, South Africa], South America[Brazil, Argentina, Columbia, Chile, Peru].

Key Companies
Intel Corporation
Toshiba Corp
Samsung Electronics
Stmicroelectronics
Taiwan Semiconductor Manufacturing
Amkor Technology
United Microelectronics
Broadcom
ASE Group
Pure Storage
Advanced Semiconductor Engineering

At the same time, we classify 3D IC & 2.5D IC Packaging according to the type, application by geography. More importantly, the report includes major countries market based on the type and application.

Market by Order Type
3D TSV
2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
Market by Application
Automotive
Consumer electronics
Medical devices
Military & aerospace
Telecommunication
Industrial sector and smart technologies


Market Segment as follows:
By Region
Asia-Pacific[China, Southeast Asia, India, Japan, Korea, Western Asia]
Europe[Germany, UK, France, Italy, Russia, Spain, Netherlands, Turkey, Switzerland]
North America[United States, Canada, Mexico]
Middle East & Africa[GCC, North Africa, South Africa]
South America[Brazil, Argentina, Columbia, Chile, Peru]

The research provides answers to the following key questions:
• What is the estimated growth rate and market share and size of the 3D IC & 2.5D IC Packaging market for the forecast period 2021 - 2026?
• What are the driving forces in the 3D IC & 2.5D IC Packaging market for the forecast period 2021 - 2026?
• Who are the prominent market players and how have they gained a competitive edge over other competitors?
• What are the market trends influencing the progress of the 3D IC & 2.5D IC Packaging industry worldwide?
• What are the major challenges and threats restricting the progress of the industry?
• What opportunities does the market hold for the prominent market players?

For any other requirements, please feel free to contact us and we will provide you customized report.