New Packages and Materials for Power Devices Market Size By Application, Industry Analysis Report, Regional Outlook (North America, Europe, Asia Pacific, Middle East & Africa, And South America), Growth Potential, Price Trends, Competitive Market Share & Forecast, 2020 - 2026
New Packages and Materials for Power Devices Market Size By Application, Industry Analysis Report, Regional Outlook (North America, Europe, Asia Pacific, Middle East & Africa, And South America), Growth Potential, Price Trends, Competitive Market Share & Forecast, 2020 - 2026 (Updated Report Available)
ID : RI_
78202 | Date :
Jun, 2020 | Pages :
167 | Region : Global |
Publisher : RI
SIC (silicon carbide) and GaN (gallium nitride) have emerged as the preferred material for making packages for high-intensity semiconductors and power devices. Such materials can support high temperature power circuits and withstand high voltage.
At the same time the power semiconductor market is undergoing a period of change. Driven by the need for increased power density and system efficiency, wide band gap (WBG) materials such as SiC and gallium nitride (GaN) are being adopted in many applications. These WBG devices require new packages, materials, and assembly methods.
The Global New Packages and Materials for Power Devices Market was valued at xxx million USD with a CAGR xx% from 2015-2019. Subsequently, it will touch xxx million USD in 2020 with a CAGR xx % from 2020 - 2026.
It also includes Market size and forecast by each application segment in terms of volume for the period 2021-2026.
In the global New Packages and Materials for Power Devices Market, This report focuses particularly in North America, South America, Europe and Asia-Pacific, and Middle East and Africa. This report classifies the Market on the basis of application, type, regions, and manufactures.
In Market segmentation by manufacturers, the report covers the following companies-
Littelfuse
Remtec, Inc.
MITSUBISHI ELECTRIC CORPORATION
Amkor Technology
Orient Semiconductor Electronics Ltd.
Infineon Technologies AG
SEMIKRON
ROHM SEMICONDUCTOR
STMicroelectronics
NXP Semiconductor
Exagan
ON Semiconductor
Efficient Power Conversion Corporation
In Market segmentation by geographical regions, the report has analysed the following regions-
North America (USA, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Columbia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
In Market segmentation by types :
Wire Bonding Packaging
Gallium Nitrid (GaN)
Chip-scale Packaging
Gallium Arsenide
Silicon Carbide
Others In Market segmentation by applications :
Telecommunications and Computing
Industrial
Electronics
Automotive
Others
The research provides answers to the following key questions:
• What is the estimated growth rate and Market share and size of the New Packages and Materials for Power Devices Market for the forecast period 2020 - 2026?
• What are the driving forces in the New Packages and Materials for Power Devices Market for the forecast period 2020 - 2026?
• Who are the prominent Market players and how have they gained a competitive edge over other competitors?
• What are the Market trends influencing the progress of the New Packages and Materials for Power Devices industry worldwide?
• What are the major challenges and threats restricting the progress of the industry?
• What opportunities does the Market hold for the prominent Market players?
Table of Contents
Global New Packages and Materials for Power Devices Consumption Market Report
1 Scope of the Report
1.1 Market Introduction
1.2 Research Objectives
1.3 Years Considered
1.4 Market Research Methodology
1.5 Economic Indicators
1.6 Currency Considered
2 Executive Summary
2.1 World Market Overview
2.1.1 Global New Packages and Materials for Power Devices Consumption 2015-2026
2.1.2 New Packages and Materials for Power Devices Consumption CAGR by Region
2.2 New Packages and Materials for Power Devices Segment by Type
2.2.1 Wire Bonding Packaging
2.2.2 Gallium Nitrid (GaN)
2.2.3 Chip-scale Packaging
2.2.4 Gallium Arsenide
2.2.5 Silicon Carbide
2.2.6 Others
2.3 New Packages and Materials for Power Devices Consumption by Type
2.3.1 Global New Packages and Materials for Power Devices Consumption Market Share by Type (2015-2019)
2.3.2 Global New Packages and Materials for Power Devices Revenue and Market Share by Type (2015-2019)
2.3.3 Global New Packages and Materials for Power Devices Sale Price by Type (2015-2019)
2.4 New Packages and Materials for Power Devices Segment by Application
2.4.1 Telecommunications and Computing
2.4.2 Industrial
2.4.3 Electronics
2.4.4 Automotive
2.4.5 Others
2.5 New Packages and Materials for Power Devices Consumption by Application
2.5.1 Global New Packages and Materials for Power Devices Consumption Market Share by Application (2015-2019)
2.5.2 Global New Packages and Materials for Power Devices Value and Market Share by Application (2015-2019)
2.5.3 Global New Packages and Materials for Power Devices Sale Price by Application (2015-2019)
3 Global New Packages and Materials for Power Devices by Players
3.1 Global New Packages and Materials for Power Devices Sales Market Share by Players
3.1.1 Global New Packages and Materials for Power Devices Sales by Players (2018-2019)
3.1.2 Global New Packages and Materials for Power Devices Sales Market Share by Players (2018-2019)
3.2 Global New Packages and Materials for Power Devices Revenue Market Share by Players
3.2.1 Global New Packages and Materials for Power Devices Revenue by Players (2018-2019)
3.2.2 Global New Packages and Materials for Power Devices Revenue Market Share by Players (2018-2019)
3.3 Global New Packages and Materials for Power Devices Sale Price by Players
3.4 Global New Packages and Materials for Power Devices Manufacturing Base Distribution, Sales Area, Product Types by Players
3.4.1 Global New Packages and Materials for Power Devices Manufacturing Base Distribution and Sales Area by Players
3.4.2 Players New Packages and Materials for Power Devices Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) (2018-2019)
3.6 New Products and Potential Entrants
3.7 Mergers & Acquisitions, Expansion
4 New Packages and Materials for Power Devices by Regions
4.1 New Packages and Materials for Power Devices by Regions
4.1.1 Global New Packages and Materials for Power Devices Consumption by Regions
4.1.2 Global New Packages and Materials for Power Devices Value by Regions
4.2 Americas New Packages and Materials for Power Devices Consumption Growth
4.3 APAC New Packages and Materials for Power Devices Consumption Growth
4.4 Europe New Packages and Materials for Power Devices Consumption Growth
4.5 Middle East & Africa New Packages and Materials for Power Devices Consumption Growth
5 Americas
5.1 Americas New Packages and Materials for Power Devices Consumption by Countries
5.1.1 Americas New Packages and Materials for Power Devices Consumption by Countries (2015-2019)
5.1.2 Americas New Packages and Materials for Power Devices Value by Countries (2015-2019)
5.2 Americas New Packages and Materials for Power Devices Consumption by Type
5.3 Americas New Packages and Materials for Power Devices Consumption by Application
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Key Economic Indicators of Few Americas Countries
6 APAC
6.1 APAC New Packages and Materials for Power Devices Consumption by Countries
6.1.1 APAC New Packages and Materials for Power Devices Consumption by Countries (2015-2019)
6.1.2 APAC New Packages and Materials for Power Devices Value by Countries (2015-2019)
6.2 APAC New Packages and Materials for Power Devices Consumption by Type
6.3 APAC New Packages and Materials for Power Devices Consumption by Application
6.4 China
6.5 Japan
6.6 Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 Key Economic Indicators of Few APAC Countries
7 Europe
7.1 Europe New Packages and Materials for Power Devices by Countries
7.1.1 Europe New Packages and Materials for Power Devices Consumption by Countries (2015-2019)
7.1.2 Europe New Packages and Materials for Power Devices Value by Countries (2015-2019)
7.2 Europe New Packages and Materials for Power Devices Consumption by Type
7.3 Europe New Packages and Materials for Power Devices Consumption by Application
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
7.9 Spain
7.10 Key Economic Indicators of Few Europe Countries
8 Middle East & Africa
8.1 Middle East & Africa New Packages and Materials for Power Devices by Countries
8.1.1 Middle East & Africa New Packages and Materials for Power Devices Consumption by Countries (2015-2019)
8.1.2 Middle East & Africa New Packages and Materials for Power Devices Value by Countries (2015-2019)
8.2 Middle East & Africa New Packages and Materials for Power Devices Consumption by Type
8.3 Middle East & Africa New Packages and Materials for Power Devices Consumption by Application
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers and Impact
9.1.1 Growing Demand from Key Regions
9.1.2 Growing Demand from Key Applications and Potential Industries
9.2 Market Challenges and Impact
9.3 Market Trends
10 Marketing, Distributors and Customer
10.1 Sales Channel
10.1.1 Direct Channels
10.1.2 Indirect Channels
10.2 New Packages and Materials for Power Devices Distributors
10.3 New Packages and Materials for Power Devices Customer
11 Global New Packages and Materials for Power Devices Market Forecast
11.1 Global New Packages and Materials for Power Devices Consumption Forecast (2020-2026)
11.2 Global New Packages and Materials for Power Devices Forecast by Regions
11.2.1 Global New Packages and Materials for Power Devices Forecast by Regions (2020-2026)
11.2.2 Global New Packages and Materials for Power Devices Value Forecast by Regions (2020-2026)
11.2.3 Americas Consumption Forecast
11.2.4 APAC Consumption Forecast
11.2.5 Europe Consumption Forecast
11.2.6 Middle East & Africa Consumption Forecast
11.3 Americas Forecast by Countries
11.3.1 United States Market Forecast
11.3.2 Canada Market Forecast
11.3.3 Mexico Market Forecast
11.3.4 Brazil Market Forecast
11.4 APAC Forecast by Countries
11.4.1 China Market Forecast
11.4.2 Japan Market Forecast
11.4.3 Korea Market Forecast
11.4.4 Southeast Asia Market Forecast
11.4.5 India Market Forecast
11.4.6 Australia Market Forecast
11.5 Europe Forecast by Countries
11.5.1 Germany Market Forecast
11.5.2 France Market Forecast
11.5.3 UK Market Forecast
11.5.4 Italy Market Forecast
11.5.5 Russia Market Forecast
11.5.6 Spain Market Forecast
11.6 Middle East & Africa Forecast by Countries
11.6.1 Egypt Market Forecast
11.6.2 South Africa Market Forecast
11.6.3 Israel Market Forecast
11.6.4 Turkey Market Forecast
11.6.5 GCC Countries Market Forecast
11.7 Global New Packages and Materials for Power Devices Forecast by Type
11.8 Global New Packages and Materials for Power Devices Forecast by Application
12 Key Players Analysis
12.1 Littelfuse
12.1.1 Company Details
12.1.2 New Packages and Materials for Power Devices Product Offered
12.1.3 Littelfuse New Packages and Materials for Power Devices Sales, Revenue, Price and Gross Margin (2018-2019)
12.1.4 Main Business Overview
12.1.5 Littelfuse News
12.2 Remtec, Inc.
12.2.1 Company Details
12.2.2 New Packages and Materials for Power Devices Product Offered
12.2.3 Remtec, Inc. New Packages and Materials for Power Devices Sales, Revenue, Price and Gross Margin (2018-2019)
12.2.4 Main Business Overview
12.2.5 Remtec, Inc. News
12.3 MITSUBISHI ELECTRIC CORPORATION
12.3.1 Company Details
12.3.2 New Packages and Materials for Power Devices Product Offered
12.3.3 MITSUBISHI ELECTRIC CORPORATION New Packages and Materials for Power Devices Sales, Revenue, Price and Gross Margin (2018-2019)
12.3.4 Main Business Overview
12.3.5 MITSUBISHI ELECTRIC CORPORATION News
12.4 Amkor Technology
12.4.1 Company Details
12.4.2 New Packages and Materials for Power Devices Product Offered
12.4.3 Amkor Technology New Packages and Materials for Power Devices Sales, Revenue, Price and Gross Margin (2018-2019)
12.4.4 Main Business Overview
12.4.5 Amkor Technology News
12.5 Orient Semiconductor Electronics Ltd.
12.5.1 Company Details
12.5.2 New Packages and Materials for Power Devices Product Offered
12.5.3 Orient Semiconductor Electronics Ltd. New Packages and Materials for Power Devices Sales, Revenue, Price and Gross Margin (2018-2019)
12.5.4 Main Business Overview
12.5.5 Orient Semiconductor Electronics Ltd. News
12.6 Infineon Technologies AG
12.6.1 Company Details
12.6.2 New Packages and Materials for Power Devices Product Offered
12.6.3 Infineon Technologies AG New Packages and Materials for Power Devices Sales, Revenue, Price and Gross Margin (2018-2019)
12.6.4 Main Business Overview
12.6.5 Infineon Technologies AG News
12.7 SEMIKRON
12.7.1 Company Details
12.7.2 New Packages and Materials for Power Devices Product Offered
12.7.3 SEMIKRON New Packages and Materials for Power Devices Sales, Revenue, Price and Gross Margin (2018-2019)
12.7.4 Main Business Overview
12.7.5 SEMIKRON News
12.8 ROHM SEMICONDUCTOR
12.8.1 Company Details
12.8.2 New Packages and Materials for Power Devices Product Offered
12.8.3 ROHM SEMICONDUCTOR New Packages and Materials for Power Devices Sales, Revenue, Price and Gross Margin (2018-2019)
12.8.4 Main Business Overview
12.8.5 ROHM SEMICONDUCTOR News
12.9 STMicroelectronics
12.9.1 Company Details
12.9.2 New Packages and Materials for Power Devices Product Offered
12.9.3 STMicroelectronics New Packages and Materials for Power Devices Sales, Revenue, Price and Gross Margin (2018-2019)
12.9.4 Main Business Overview
12.9.5 STMicroelectronics News
12.10 NXP Semiconductor
12.10.1 Company Details
12.10.2 New Packages and Materials for Power Devices Product Offered
12.10.3 NXP Semiconductor New Packages and Materials for Power Devices Sales, Revenue, Price and Gross Margin (2018-2019)
12.10.4 Main Business Overview
12.10.5 NXP Semiconductor News
12.11 Exagan
12.12 ON Semiconductor
12.13 Efficient Power Conversion Corporation
13 Research Findings and Conclusion
Research Methodology
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The Company's Research Process Has the Following Advantages:
Information Procurement
The step comprises the procurement of market-related information or data via different methodologies & sources.
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This step entails the placement of data points at suitable market spaces in an effort to assume possible conclusions. Analyst viewpoint and subject matter specialist based examining the form of market sizing also plays an essential role in this step.
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