New Packages and Materials for Power Devices Market (Updated Version Available)

New Packages and Materials for Power Devices Market 2020 by Manufacturers, Regions Analysis(Europe, Asia Pacific, North America and South America), Type and Application, Forecast to 2025

Report ID : RI_13870 | Date : February 2020 | Format : ms word ms Excel PPT PDF

This Report Includes The Most Up-To-Date Market Figures, Statistics & Data
The multinational New Packages and Materials for Power Devices market had reached xxx million USD with a CAGR xx from 2015-2019. Later on, it will go to xxx million USD in 2020 with a CAGR xx % from 2020 to 2025.
SIC (silicon carbide) and GaN (gallium nitride) have emerged as the preferred material for making packages for high-intensity semiconductors and power devices. Such materials can support high temperature power circuits and withstand high voltage.
At the same time the power semiconductor market is undergoing a period of change. Driven by the need for increased power density and system efficiency, wide band gap (WBG) materials such as SiC and gallium nitride (GaN) are being adopted in many applications. These WBG devices require new packages, materials, and assembly methods.

In the global New Packages and Materials for Power Devices market, This report focuses particularly in North America, South America, Europe and Asia-Pacific, and Middle East and Africa. This report classifies the market on the basis of application, type, regions, and manufactures.

In market segmentation by manufacturers, the report covers the following companies-
Littelfuse
Remtec, Inc.
MITSUBISHI ELECTRIC CORPORATION
Amkor Technology
Orient Semiconductor Electronics Ltd.
Infineon Technologies AG
SEMIKRON
ROHM SEMICONDUCTOR
STMicroelectronics
NXP Semiconductor
Exagan
ON Semiconductor
Efficient Power Conversion Corporation

In market segmentation by geographical regions, the report has analysed the following regions-
North America (USA, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Columbia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

In market segmentation by types :
Wire Bonding Packaging
Gallium Nitrid (GaN)
Chip-scale Packaging
Gallium Arsenide
Silicon Carbide
Others

In market segmentation by applications :
Telecommunications and Computing
Industrial
Electronics
Automotive
Others

The research provides answers to the following key questions:
• What is the estimated growth rate and market share and size of the New Packages and Materials for Power Devices market for the forecast period 2020 - 2025?
• What are the driving forces in the New Packages and Materials for Power Devices market for the forecast period 2020 - 2025?
• Who are the prominent market players and how have they gained a competitive edge over other competitors?
• What are the market trends influencing the progress of the New Packages and Materials for Power Devices industry worldwide?
• What are the major challenges and threats restricting the progress of the industry?
• What opportunities does the market hold for the prominent market players?
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