Metal plating (also known as electroplating or electrodeposition) is a coating technology that deposits a thin later of a metal or alloy on a conductive surface to impart particular functional or aesthetic properties. During the plating process, the object to be plated functions as the positively charged cathode while the desired plating material serves as the negatively charged anode and source of the metallic ions that will form the final coating. Immersing both materials in a bath or solution of electrolyte salts and adding an electrical current causes an oxidation/reduction reaction on the surface of the cathode where the metallic ions are deposited.
There are numerous metals commonly used as plating materials such as zinc, copper, chromium, and nickel. which impart wear and corrosion resistance, improve strength, and enhance solderability. Precious metal coatings are especially important to the electronics and semiconductor industries.
The market is majorly driven by the increasing demand from the microelectronics industry verticals. In this modern era, the disruptiveness of technology innovations in the consumer electronics sector is fast paced and the innovations are becoming easily accessible and affordable. The growing consumer needs, emergence of many new start-ups, IP infringement issues, and strong competition are forcing manufacturers to innovate and continuously asses growth opportunities.
China is by far the largest consumer of semiconductors; it accounts for about 45 percent of the worldwide demand for chips, used both in China and for exports. But more than 90 percent of its consumption relies on imported integrated circuits. Integrated-circuit companies in China entered the semiconductor market late—some two decades after the rest of the world—and have been playing catch-up ever since in an industry in which success depends on scale and learning efficiencies. The Chinese government made several attempts to build a local semiconductor industry, but none really took hold. Now, however, things are changing on both the business and policy fronts.
The leading companies own the advantages on better performance, more abundant product\'s types, better technical and impeccable after-sales service. Consequently, they take the majority of the market share of high-end market. Looking to the future years, the slow downward price trend in recent years will maintain. As competition intensifies, prices gap between different brands will go narrowing. Similarly, there will be fluctuation in gross margin.
The report offers detailed coverage of Plating for Microelectronics industry and main market trends. The market research includes historical and forecast market data, demand, application details, price trends, and company shares of the leading Plating for Microelectronics by geography. The report splits the market size, by volume and value, on the basis of application type and geography.
The report forecast global Plating for Microelectronics market to grow to reach xxx Million USD in 2020 with a CAGR of xx% during the period 2021-2027.
First, this report covers the present status and the future prospects of the global Plating for Microelectronics market for 2015-2027.
And in this report, we analyze global market from 5 geographies: Asia-Pacific[China, Southeast Asia, India, Japan, Korea, Western Asia], Europe[Germany, UK, France, Italy, Russia, Spain, Netherlands, Turkey, Switzerland], North America[United States, Canada, Mexico], Middle East & Africa[GCC, North Africa, South Africa], South America[Brazil, Argentina, Columbia, Chile, Peru].
Key Companies
DOW
Mitsubishi Materials Corporation
Heraeus
XiLong Scientific
Atotech
Yamato Denki
Meltex
Ishihara Chemical
Raschig GmbH
Japan Pure Chemical
Coatech
MAGNETO special anodes
Vopelius Chemie AG
Moses Lake Industries
JCU International
At the same time, we classify Plating for Microelectronics according to the type, application by geography. More importantly, the report includes major countries market based on the type and application.
Market Segment as follows:
Market by Order Type
Gold
Zinc
Nickel
Bronze
Tin
Copper
Others
Market by Application
MEMS
PCB
IC
Photoelectron
Others
By Region
Asia-Pacific[China, Southeast Asia, India, Japan, Korea, Western Asia]
Europe[Germany, UK, France, Italy, Russia, Spain, Netherlands, Turkey, Switzerland]
North America[United States, Canada, Mexico]
Middle East & Africa[GCC, North Africa, South Africa]
South America[Brazil, Argentina, Columbia, Chile, Peru]
The research provides answers to the following key questions:
• What is the estimated growth rate and market share and size of the Plating for Microelectronics market for the forecast period 2021 - 2027?
• What are the driving forces in the Plating for Microelectronics market for the forecast period 2021 - 2027?
• Who are the prominent market players and how have they gained a competitive edge over other competitors?
• What are the market trends influencing the progress of the Plating for Microelectronics industry worldwide?
• What are the major challenges and threats restricting the progress of the industry?
• What opportunities does the market hold for the prominent market players?